Technical Strengths

Design for Additive Manufacturing

  • Familiar with powder bed fusion (PBF), fused deposition modeling (FDM), and stereolithography (SLA) additive manufacturing methods.
  • Function based design.
  • Part orientation selection to optimize accuracy and minimize support structure.
  • Integrating assemblies to reduce part count.
  • Minimum feature size enabled by the chosen AM method.
  • Other consideration such as thermal history or providing escape holes.

FEA Simulations & Topology Optimizations

  • Finite element modeling of structural systems using Ansys Mechanical or Abaqus FEA.
  • Experience in performing topology optimization to produce lightweight strong structures and minimizing stress concentrations.
  • Currently learning multi-physics modeling using OpenFOAM.

Digital Image Correlation

  • Experience in using DIC for 3D and 2D deformation and displacement.
  • Adjust and calibrate the DIC sensors depending on the desired focus volume and distance.
  • Create surface components and reference coordinates.
  • Analyze principal strains, displacement, velocity, and acceleration.
  • Create virtual extensometers and reference points.
  • Integrate load cell data with strain data from DIC to characterize the material properties.

Design of Experiments

  • Full and fractional factorial designs.
  • Response Surface Methodology (RSM). .
  • Taguchi orthogonal arrays. es.
  • Signal to noise ratio.
  • Analysis of Variance (ANOVA).

Multi-Objective Optimization

  • Multi-Objective Particle Swarm Optimization (MOPSO).
  • Technique for Order Preference by Similarity to Ideal Solution (TOPSIS).
  • Genetic Algorithms (NSGA-II). .

Machine Learning

  • Artificial Neural Network
  • Multiple Linear Regression
  • Nonlinear Regression
  • K-Nearest Neighbors
  • Support Vector Machine

Sample Prep

  • Cut and extract suitable sized specimens for the desired characterization technique.
  • Grind and polish specimens to mirror finish.
  • Chemical etch according to ASTM E407 standard.
  • Experience with different sample holders.
  • Knowledge of sputter coating and electric grounding techniques.


  • Optical microscopy using brightfield and darkfield.
  • Scanning electron microscopy (SEM) using secondary electron detector and backscatter electron detector.
  • Fundamental knowledge on the use of transmission electron microscopy (TEM).

X-ray Diffraction and EDS Spectroscopy

  • XRD to identify phases present in a specimen or powder.
  • Identification of grain size and texture.
  • Quantitative Rietveld refinement to estimate the volume fraction of phases present.
  • EDS spectroscopy to identify elemental composition of a sample.
  • EDS spectroscopy mapping to identify, precipitation, segregation, and oxidation in a sample.