Technical Strengths
Design for Additive Manufacturing
- Familiar with powder bed fusion (PBF), fused deposition modeling (FDM), and stereolithography (SLA) additive manufacturing methods.
- Function based design.
- Part orientation selection to optimize accuracy and minimize support structure.
- Integrating assemblies to reduce part count.
- Minimum feature size enabled by the chosen AM method.
- Other consideration such as thermal history or providing escape holes.
FEA Simulations & Topology Optimizations
- Finite element modeling of structural systems using Ansys Mechanical or Abaqus FEA.
- Experience in performing topology optimization to produce lightweight strong structures and minimizing stress concentrations.
- Currently learning multi-physics modeling using OpenFOAM.
Digital Image Correlation
- Experience in using DIC for 3D and 2D deformation and displacement.
- Adjust and calibrate the DIC sensors depending on the desired focus volume and distance.
- Create surface components and reference coordinates.
- Analyze principal strains, displacement, velocity, and acceleration.
- Create virtual extensometers and reference points.
- Integrate load cell data with strain data from DIC to characterize the material properties.
Design of Experiments
- Full and fractional factorial designs.
- Response Surface Methodology (RSM).
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- Taguchi orthogonal arrays.
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- Signal to noise ratio.
- Analysis of Variance (ANOVA).
Multi-Objective Optimization
- Multi-Objective Particle Swarm Optimization (MOPSO).
- Technique for Order Preference by Similarity to Ideal Solution (TOPSIS).
- Genetic Algorithms (NSGA-II).
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Machine Learning
- Artificial Neural Network
- Multiple Linear Regression
- Nonlinear Regression
- K-Nearest Neighbors
- Support Vector Machine
Sample Prep
- Cut and extract suitable sized specimens for the desired characterization technique.
- Grind and polish specimens to mirror finish.
- Chemical etch according to ASTM E407 standard.
- Experience with different sample holders.
- Knowledge of sputter coating and electric grounding techniques.
Microscopy
- Optical microscopy using brightfield and darkfield.
- Scanning electron microscopy (SEM) using secondary electron detector and backscatter electron detector.
- Fundamental knowledge on the use of transmission electron microscopy (TEM).
X-ray Diffraction and EDS Spectroscopy
- XRD to identify phases present in a specimen or powder.
- Identification of grain size and texture.
- Quantitative Rietveld refinement to estimate the volume fraction of phases present.
- EDS spectroscopy to identify elemental composition of a sample.
- EDS spectroscopy mapping to identify, precipitation, segregation, and oxidation in a sample.
